number: db-001 july 2011, revision f page 1 tak cheong ? semiconductor 200mw sod-523 surface mount very small outline flat lead plastic package general purpose application fast switching diode absolute maximum ratings t a = 25c unless otherwise noted symbol parameter value units p d power dissipation 200 mw t stg storage temperature range -55 to +150 c t j operating junction temperature +150 c v rsm non-repetitive peak reverse voltage 100 v v rrm repetitive peak reverse voltage 75 v i frm repetitive peak forward current 300 ma i o continuous forward current 150 ma i fsm non-repetitive peak forward surge current (pulse width=1us) 2 a these ratings are limiting values above which the serviceability of the diode may be impaired. specification features: ? fast switching device ( t rr <4.0 ns) ? general purpose diodes ? extremely small sod-523 package ? flat lead sod-523 small outline plastic package ? surface device type mounting ? rohs compliant ? green emc ? matte tin(sn) lead finish ? band indicates cathode device marking code: device type device marking tc1n4148wt e1 tc1n4448wt e2 TC1N914BWT e3 electrical characteristics t a = 25c unless otherwise noted limits symbol parameter test condition min max unit b v breakdown voltage i r =100a i r =5a 100 75 volts i r reverse leakage current v r =20v v r =75v 25 5 na a v f forward voltage tc1n4448wt, TC1N914BWT tc1n4448wt, tc1n4148wt tc1n4448wt, TC1N914BWT i f =5ma i f =10ma i f =100ma 0.62 0.72 1.0 1.0 volts t rr reverse recovery time i f =10ma i r =60ma r l =100 i rr =1ma 4 ns c capacitance v r =0v, f=1m hz 4 pf tc1n4148wt/tc1n4448wt/TC1N914BWT
number: db-001 july 2011, revision f page 2 tak cheong ? semiconductor typical performance characteristics total capacitance forward voltage vs ambient temperature
number: db-001 july 2011, revision f page 3 tak cheong ? semiconductor reverse current vs reverse voltagereverse
number: db-001 july 2011, revision f page 4 tak cheong ? semiconductor flat lead sod-523 package outline note: dimensions are exclusive of burrs, mold flash & tie bar extrusions.
number: db-100 april 14, 2008 / a disclaimer notice tak cheong ? notice the information presented in this document is for reference only. tak cheong reserves the right to make changes without notice for the specification of the products displayed herein. the product listed herein is designed to be used with ordinary electronic equipment or devices, and not designed to be used with equipment or devices which require high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controlle rs and other safety devices), tak cheong semiconductor co., ltd., or anyone on its behalf, assumes no responsi bility or liability for any damagers resulting from such improper use of sale. this publication supersedes & replaces all information reviously supplied. for additional information, please visit our website http://www.takcheong.com , or consult your nearest tak cheong?s sales office for further assistance.
|
